Publisher
Japan Institute of Electronics Packaging
Subject
Electrical and Electronic Engineering
Cited by
4 articles.
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1. Present, Past, and Future of 3D Integration;Journal of The Japan Institute of Electronics Packaging;2024-03-01
2. 3D-IC のテスト技術;Journal of The Japan Institute of Electronics Packaging;2023-11-01
3. チップレットの概念と3D-ICのラピッドプロトタイピング;Journal of The Japan Institute of Electronics Packaging;2023-07-01
4. 微細バンプ接合による積層チップ間接続技術;Journal of The Japan Institute of Electronics Packaging;2023-05-01