Direct heat pipe cooling of semiconductor devices-Reference-Cited by-同舟云学术

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Direct heat pipe cooling of semiconductor devices

Published:1978-05-22 Issue: Volume: Page:
ISSN:
Container-title:3rd International Heat Pipe Conference
language:
Short-container-title:

Author:

NELSON L.¹,SEKHON K.¹,FRITZ J.¹

Affiliation:

1. Hughes Aircraft Co., Fullerton, Calif.

Publisher

American Institute of Aeronautics and Astronautics

Link

http://arc.aiaa.org/doi/pdf/10.2514/6.1978-450

Reference5 articles.

1. Cotter, T. P. "Theory of Heat FYpes,"LA-3246-ms, March 1965.

2. Sekhon, K. S., Nelson, L.A. and Fritz, J. E."Improved MIC Performance Through Mernal Heat Pipe Cooling,11 National Electronic Packaging and Production Conference, March 1977 and May 1977.

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