Heat Generation Characteristics and Heat Dissipation Experiment of CPU Chip-Reference-Cited by-同舟云学术

Heat Generation Characteristics and Heat Dissipation Experiment of CPU Chip

Published:2013-10 Issue: Volume:437 Page:1057-1061
ISSN:1662-7482
Container-title:Applied Mechanics and Materials
language:
Short-container-title:AMM

Author:

Li Mao De¹,Wei Shuai¹

Affiliation:

1. Tongji University

Abstract

With the development of the CPU integration, providing effective heat removal solutions for chip is an important research. This article analyses the reason of chip overheat and different adopted techniques in chip heat dissipation and commits itself to take the variation of the operating conditions into account to obtain the overall temperature rising curve based on a simplified thermal model. And then it utilizes heating plate as constant heat source to simulate CPU heating. Under the power of 20W, 30W and 40W, we compare five kinds of fan-cooled radiators in order to provide the experimental statistics for the further design and theoretical analysis.

Publisher

Trans Tech Publications, Ltd.

Link

https://www.scientific.net/AMM.437.1057.pdf

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