Experimental Study on a New Type of Cooling Device Used in High Heat Dissipation of CPU-Reference-Cited by-同舟云学术

Experimental Study on a New Type of Cooling Device Used in High Heat Dissipation of CPU

Published:2012-12 Issue: Volume:241-244 Page:156-159
ISSN:1662-7482
Container-title:Applied Mechanics and Materials
language:
Short-container-title:AMM

Author:

Liu Meng¹,Wang Fang²,Lou Lei¹,Dai Sheng Liang¹,Da Wei Feng¹

Affiliation:

1. University of Shanghai for Science and Technology

2. University of Shanghai for Science and Technology, Institute of Refrigeration Technology

Abstract

A new type of cooling device used for server is designed in this paper. A small type of server is taken as a research object to compare the effect of air cooling and evaporative cooling under different CPU power consumption. The effects of this research are discussed on evaporative cooling for the stability of the CPU heat dissipation and the cooler on other components. The results show that the temperature distribution of the server’s case is more uniform and the temperature test of the CPU is more stable when it is cooled by evaporative cooling.

Publisher

Trans Tech Publications, Ltd.

Link

https://www.scientific.net/AMM.241-244.156.pdf

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