Soft Defect Localization (SDL) on ICs-Reference-Cited by-同舟云学术

Soft Defect Localization (SDL) on ICs

Published:2002-10-01 Issue: Volume: Page:
ISSN:0890-1740
Container-title:International Symposium for Testing and Failure Analysis
language:
Short-container-title:

Author:

Bruce Michael R.¹,Bruce Victoria J.¹,Eppes David H.¹,Wilcox Jacob¹,Cole Edward I.²,Tangyunyong Paiboon²,Hawkins Charles F.³

Affiliation:

1. Advanced Micro Devices, Inc., Austin, Texas

2. Sandia National Laboratories, Albuquerque, New Mexico

3. University of New Mexico, Albuquerque, New Mexico

Abstract

Abstract We have developed a new scanning laser microscopy methodology, Soft Defect Localization (SDL), that directly locates soft defects from the front side and backside of an IC. The method combines localized laser heating with the pass/fail state of a device to successfully localize soft defects. Subtle, thermally sensitive soft defects can be localized by careful selection of the IC voltage, temperature, and operating frequency. Several examples are shown.

Publisher

ASM International

Link

http://dl.asminternational.org/istfa/proceedings-pdf/doi/10.31399/asm.cp.istfa2002p0021/419339/istfa2002p0021.pdf

Cited by 16 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Laser-Based, Photon, and Thermal Emission;Electronic Device Failure Analysis Technology Roadmap;2023-11-01

2. Laser-Based, Photon, and Thermal Emission;Electronic Device Failure Analysis Technology Roadmap;2023-11-01

3. Dynamic Analysis by Laser Stimulation (DALS) Applied on Analog and mixed-signal IC;2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA);2023-07-24

4. Recovered Scan Failure Investigation and Failure Mechanism Determination;2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA);2023-07-24

5. Thermal Sensitivity Mapping with OBIRCH;2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA);2023-07-24