Dynamic Analysis by Laser Stimulation (DALS) Applied on Analog and mixed-signal IC
Author:
Affiliation:
1. NXP Manufacturing (Thailand), Failure Analyst, PQC,Bangkok
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10248978/10248979/10249081.pdf?arnumber=10249081
Reference7 articles.
1. Soft Defect Localization (SDL) on ICs
2. A Novel Method to Analyze Analog and Mixed Mode IC Failure by Soft Defect Localization (SDL);li;IPFA2011,0
3. SDL analysis in temperature sensitive failure based on DALS system
4. Methodology to support laser-localized soft defects on analog and mixed-mode advanced ICs
5. SDL(Soft Defect Location) Technical in Analysing the Laser Beam Wavelength, and Temperature Sensitive Failures in VLSI Failure Analysis;wen;IPFA2015,0
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