Author:
Zhong Yu,Wong Martin D.F.
Cited by
6 articles.
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1. Parallel Per-tile Activation with Linear Superposition of Thermal Response for Solving Arbitrary Power Pattern in 3DIC Thermal Simulation;Proceedings of the 2024 ACM/IEEE International Symposium on Machine Learning for CAD;2024-09-09
2. A Thermal Machine Learning Solver For Chip Simulation;Proceedings of the 2022 ACM/IEEE Workshop on Machine Learning for CAD;2022-09-12
3. A Thermal Machine Learning Solver For Chip Simulation;2022 ACM/IEEE 4th Workshop on Machine Learning for CAD (MLCAD);2022-09-12
4. Optimizing Design Power Integrity using IR-Aware Placement;2022 37th International Technical Conference on Circuits/Systems, Computers and Communications (ITC-CSCC);2022-07-05
5. ML-based Fast On-Chip Transient Thermal Simulation for Heterogeneous 2.5D/3D IC Designs;2022 International Symposium on VLSI Design, Automation and Test (VLSI-DAT);2022-04-18