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ML-based Fast On-Chip Transient Thermal Simulation for Heterogeneous 2.5D/3D IC Designs

  • Published:2022-04-18 Issue: Volume: Page:
  • ISSN:
  • Container-title:2022 International Symposium on VLSI Design, Automation and Test (VLSI-DAT)
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Author:

Kumar Akhilesh1,Chang Norman1,Geb David1,He Haiyang1,Pan Stephen1,Wen Jimin1,Asgari Saeed1,Abarham Mehdi1,Ortiz Chris1

Affiliation:

1. Ansys,San Jose,USA

Publisher

IEEE

Reference13 articles.

1. New Thermal Issues Emerge;mutschler;Semiconductor Engineering,2018

2. Hybrid Chips may Solve Thermal, Efficiency, and Integration Challenges in 5G Mobile Devices;emilio;Electric Power's News,2019

3. Thermal-Aware IR Drop Analysis in Large Power Grid

4. Protecting AI Chips from Thermal Challenges during ATE Test;peach;Evaluation Engineering Magazine,2019

5. Thermal sensor placement based on meta-model enhancing observavility and controlability;im;ITHERM,2020

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1. Parallel Per-tile Activation with Linear Superposition of Thermal Response for Solving Arbitrary Power Pattern in 3DIC Thermal Simulation;Proceedings of the 2024 ACM/IEEE International Symposium on Machine Learning for CAD;2024-09-09

2. Thermal-Aware Test Frequency Optimization;2024 IEEE International Test Conference in Asia (ITC-Asia);2024-08-18

3. Characteristics analysis and structure optimization of a hybrid micro-jet impingement/micro-channel heat sink;Applied Thermal Engineering;2024-05

4. Design for Reliability (DFR) Aware EDA Solution for Product Reliability (Invited);2024 IEEE International Reliability Physics Symposium (IRPS);2024-04-14

5. Hybrid chips to enable a sustainable internet of things technology: opportunities and challenges;Discover Materials;2024-02-21
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