A Thermal Machine Learning Solver For Chip Simulation-Reference-Cited by-同舟云学术

A Thermal Machine Learning Solver For Chip Simulation

Published:2022-09-12 Issue: Volume: Page:
ISSN:
Container-title:Proceedings of the 2022 ACM/IEEE Workshop on Machine Learning for CAD
language:
Short-container-title:

Author:

Ranade Rishikesh¹,He Haiyang¹,Pathak Jay²,Chang Norman²,Kumar Akhilesh²,Wen Jimin²

Affiliation:

1. Ansys Inc, Canonsburg, PA, USA

2. Ansys Inc, San Jose, CA, USA

Publisher

ACM

Link

https://dl.acm.org/doi/pdf/10.1145/3551901.3556484

Reference18 articles.

1. Physics-Informed Neural Networks for Heat Transfer Problems

2. R Chandra . 2006. It's Time To Consider Temperature Gradients In IC Design. Electronic Design ( 2006 ). R Chandra. 2006. It's Time To Consider Temperature Gradients In IC Design. Electronic Design (2006).

3. Thermal and IR Drop Analysis Using Convolutional Encoder-Decoder Networks

4. M Emilio . 2019. Hybrid Chips may Solve Thermal Efficiency and Integration Challenges in 5G Mobile Devices. Power Electronics News ( 2019 ). M Emilio. 2019. Hybrid Chips may Solve Thermal Efficiency and Integration Challenges in 5G Mobile Devices. Power Electronics News (2019).

5. Ian Goodfellow , Yoshua Bengio , Aaron Courville , and Yoshua Bengio . 2016. Deep learning . Vol. 1 . MIT press Cambridge . Ian Goodfellow, Yoshua Bengio, Aaron Courville, and Yoshua Bengio. 2016. Deep learning. Vol. 1. MIT press Cambridge.

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Steady-State temperature field prediction for FPGA chips with reduced number of temperature sensors;Measurement;2025-01

2. Parallel Per-tile Activation with Linear Superposition of Thermal Response for Solving Arbitrary Power Pattern in 3DIC Thermal Simulation;Proceedings of the 2024 ACM/IEEE International Symposium on Machine Learning for CAD;2024-09-09

3. Heat transfer enhancement for 3D chip thermal simulation and prediction;Applied Thermal Engineering;2024-01

4. DeepOHeat: Operator Learning-based Ultra-fast Thermal Simulation in 3D-IC Design;2023 60th ACM/IEEE Design Automation Conference (DAC);2023-07-09