A co-synthesis methodology for power delivery and data interconnection networks in 3D ICs
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Publisher
IEEE
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http://xplorestaging.ieee.org/ielx7/6520923/6523572/06523593.pdf?arnumber=6523593
Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. MOELA: A Multi-Objective Evolutionary/Learning Design Space Exploration Framework for 3D Heterogeneous Manycore Platforms;2023 Design, Automation & Test in Europe Conference & Exhibition (DATE);2023-04
2. Alternative Approaches;Design and Test Strategies for 2D/3D Integration for NoC-based Multicore Architectures;2019-12-21
3. Co-synthesis of contention-free energy-efficient NOC-based real time embedded systems;Journal of Systems Architecture;2019-09
4. Voltage scaling for 3-D ICs: When, how, and how much?;Microelectronics Journal;2017-11
5. Integrated Through-Silicon Via Placement and Application Mapping for 3D Mesh-Based NoC Design;ACM Transactions on Embedded Computing Systems;2016-11-03
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