Integrated Through-Silicon Via Placement and Application Mapping for 3D Mesh-Based NoC Design

Author:

Manna Kanchan1,Swami Shivam2,Chattopadhyay Santanu2,Sengupta Indranil1

Affiliation:

1. Indian Institute of Technology (IIT) Kharagpur

2. Indian Institute of Technology (IIT) Kharagpur, West Bengal, India

Abstract

This article proposes a solution to the integrated problem of Through-Silicon Via (TSV) placement and mapping of cores to the routers in a three-dimensional mesh-based Network-on-Chip (NoC) system. TSV geometry restricts their number in three-dimensional (3D) ICs. As a result, only about 25% of routers in a 3D NoC can possess vertical connections. Mapping plays an important role in evolving good system solutions in such a situation. TSVs have been placed with detailed consultation with the application mapping process. The integrated problem was first solved using the exact method of Integer Liner Programming (ILP). Next, a solution was obtained via a Particle Swarm Optimization (PSO) formulation. Several augmentations to the basic PSO strategy have been proposed to generate good-quality solutions. The results obtained are better than many of the contemporary approaches and close to the theoretical situation in which all routers are 3D in nature.

Funder

Department of Science and Technology

Govt. of India

Publisher

Association for Computing Machinery (ACM)

Subject

Hardware and Architecture,Software

Reference64 articles.

1. 2010. Single-Chip Cloud Computer. http://techresearch.intel.com/UserFiles/en-us/File/SCC_Symposium_Mar162010_GML_final.pdf. 2010. Single-Chip Cloud Computer. http://techresearch.intel.com/UserFiles/en-us/File/SCC_Symposium_Mar162010_GML_final.pdf.

2. 2010. The AMD opteron 6000 series platform. http://www.amd.com. 2010. The AMD opteron 6000 series platform. http://www.amd.com.

3. Low-overhead Routing Algorithm for 3D Network-on-Chip

4. Traffic-aware selection strategy for application-specific 3d NoC;Azampanah S.;Journal,2013

5. A 3D-NoC Router Implementation Exploiting Vertically-Partially-Connected Topologies

Cited by 18 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3