A 1.2 V 20 nm 307 GB/s HBM DRAM With At-Speed Wafer-Level IO Test Scheme and Adaptive Refresh Considering Temperature Distribution

Author:

Sohn KyominORCID,Yun Won-Joo,Oh Reum,Oh Chi-Sung,Seo Seong-Young,Park Min-Sang,Shin Dong-Hak,Jung Won-Chang,Shin Sang-Hoon,Ryu Je-Min,Yu Hye-Seung,Jung Jae-Hun,Lee Hyunui,Kang Seok-Yong,Sohn Young-Soo,Choi Jung-Hwan,Bae Yong-Cheol,Jang Seong-Jin,Jin Gyoyoung

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Cited by 38 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. A 4-nm 1.15 TB/s HBM3 Interface With Resistor-Tuned Offset Calibration and In Situ Margin Detection;IEEE Journal of Solid-State Circuits;2024-01

2. NeuroCool: Dynamic Thermal Management of 3D DRAM for Deep Neural Networks through Customized Prefetching;ACM Transactions on Design Automation of Electronic Systems;2023-12-18

3. Evaluating embedded hardware for high-order wavefront sensing and control;Techniques and Instrumentation for Detection of Exoplanets XI;2023-10-05

4. MPU: Memory-centric SIMT Processor via In-DRAM Near-bank Computing;ACM Transactions on Architecture and Code Optimization;2023-07-19

5. History of MOS Memory Evolution on DRAM and SRAM;75th Anniversary of the Transistor;2023-07-03

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3