Domain Decomposition and Reduction Method for Efficient Thermal Simulation and Design of 2.5D Heterogeneous Integration
Author:
Affiliation:
1. Shanghai Jiao Tong University,State Key Laboratory of Radio Frequency Heterogeneous Integration,Shanghai,China
Funder
National Natural Science Foundation of China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx8/10616249/10617469/10617548.pdf?arnumber=10617548
Reference16 articles.
1. Multi-chip technologies to unleash computing performance gains over the next decade
2. Comprehensive Study on 2.5D Package Design for Board-Level Reliability in Thermal Cycling and Power Cycling
3. 2.2 AMD Chiplet Architecture for High-Performance Server and Desktop Products
4. Heterogeneously Integrated RF Circuits Using Highly Scaled off-the-Shelf GaN HEMT Chiplets
5. Modeling and Design of 2.5D Package with Mitigated Warpage and Enhanced Thermo-Mechanical Reliability
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