Author:
Wang Jing,Niu Yuling,Park Seungbae,Yatskov Alexander
Cited by
17 articles.
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1. Thermomechanical Challenges of 2.5-D Packaging: A Review of Warpage and Interconnect Reliability;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-10
2. Recent Advances and Trends in Multiple System and Heterogeneous Integration With TSV Interposers;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-01
3. Multiple System and Heterogeneous Integration with TSV-Interposers;Chiplet Design and Heterogeneous Integration Packaging;2023
4. Interface StressAnalysis Based on Warpage Characterization in a Flip-Chip Package;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10
5. Optimal thermo-mechanical reliability design of 2.5D lidless package;2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm);2022-05-31