Heterogeneously Integrated RF Circuits Using Highly Scaled off-the-Shelf GaN HEMT Chiplets

Author:

Herrault FlorianORCID,Wong Joel C.ORCID,Tang Yan,Tai Haw Y.,Ramos Ignacio

Funder

Defense Advanced Research Projects Agency

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Condensed Matter Physics

Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Millimeter-Wave Gallium Nitride Maturation of 40nm T3 Gallium Nitride Monolithic Microwave Integrated Circuit Process;2023 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS);2023-10-16

2. Approaches to Heterogeneous Integration for Millimeter-Wave Applications;Journal of the Russian Universities. Radioelectronics;2023-09-29

3. 38 GHz T/R Heterogeneous Integrated Module;2022 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP);2022-11-27

4. Fast Thermal Analysis for Chiplet Design based on Graph Convolution Networks;2022 27th Asia and South Pacific Design Automation Conference (ASP-DAC);2022-01-17

5. Design of Ka-band broadband low-noise amplifier using 100nm gate-length GaN on silicon technology;Journal of Physics: Conference Series;2021-07-01

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