Shear testing and failure mode analysis for evaluation of BGA ball attachment-Reference-Cited by-同舟云学术

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Shear testing and failure mode analysis for evaluation of BGA ball attachment

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Container-title:Twenty Fourth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.99CH36330)
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Author:

Erich R.,Coyle R.J.,Wenger G.M.,Primavera A.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/6537/17443/00804791.pdf?arnumber=804791

Cited by 14 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Fatigue performance and microstructure of lead-free solder joints in BGA assembly at room temperature;Microelectronics Reliability;2023-10

2. Effect of temperature on the low cycle fatigue properties of BGA solder joints;Microelectronics Reliability;2023-07

3. Effect of Bi content and aging on solder joint shear properties considering strain rate;Microelectronics Reliability;2023-07

4. Shear Fatigue Analysis of SAC-Bi Solder Joint Exposed to Varying Stress Cycling Conditions;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-02

5. Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis;Journal of Electronic Packaging;2022-09-28

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