Author:
Pei-Jer Tzeng ,Chang Y.-Y.I.,Chun-Chen Yeh ,Chih-Chiang Chen ,Chien-Hung Liu ,Mu-Yi Liu ,Bone-Fong Wu ,Kuei-Shu Chang-Liao
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Cited by
4 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Chip Reliability;Silicon Analog Components;2019-08-08
2. Chip Reliability;Silicon Analog Components;2015
3. Plasma Damage Mechanism of Electron Beam Curing Process for Spin on Dielectrics;IEEE Electron Device Letters;2013-05
4. Device Principles of High-K Dielectrics;Materials Fundamentals of Gate Dielectrics