Author:
Chen D.Y.,Chiou W.C.,Chen M.F.,Wang T.D.,Ching K.M.,Tu H.J.,Wu W.J.,Yu C.L.,Yang K.F.,Chang H.B.,Tseng M.H.,Hsiao C.W.,Lu Y.J.,Hu H.P.,Lin Y.C.,Hsu C.S.,Shue Winston S.,Yu C.H.
Cited by
12 articles.
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1. Low-hole concentration polycrystalline germanium by CO2 laser annealing for the fabrication of an enhancement-mode nMOSFET;Applied Physics Express;2018-09-26
2. TSV Fabrication;Analog Circuits and Signal Processing;2014-08-22
3. TSV Macro-Modeling Framework;Analog Circuits and Signal Processing;2014-08-22
4. Conclusions and Future Directions;SpringerBriefs in Electrical and Computer Engineering;2012-08-27
5. TSVs for Power Delivery;SpringerBriefs in Electrical and Computer Engineering;2012-08-27