A Novel Layout-Based Single Event Transient Injection Approach to Evaluate the Soft Error Rate of Large Combinational Circuits in Complimentary Metal-Oxide-Semiconductor Bulk Technology-Reference-Cited by-同舟云学术

A Novel Layout-Based Single Event Transient Injection Approach to Evaluate the Soft Error Rate of Large Combinational Circuits in Complimentary Metal-Oxide-Semiconductor Bulk Technology

Published:2016-03 Issue:1 Volume:65 Page:248-255
ISSN:0018-9529
Container-title:IEEE Transactions on Reliability
language:
Short-container-title:IEEE Trans. Rel.

Author:

Du Yankang,Chen Shuming

Funder

State Key Program of National Natural Science Foundation of China

National Natural Science Foundation of China

Hunan Provincial Innovation Foundation for Postgraduate, China

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Safety, Risk, Reliability and Quality

Link

http://xplorestaging.ieee.org/ielx7/24/7422884/7101881.pdf?arnumber=7101881

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