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Yield Forecasting Across Semiconductor Fabrication Plants and Design Generations

  • Published:2017-12 Issue:12 Volume:36 Page:2120-2133
  • ISSN:0278-0070
  • Container-title:IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
  • language:
  • Short-container-title:IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst.

Author:

Ahmadi Ali,Stratigopoulos Haralampos-G.,Huang Ke,Nahar Amit,Orr Bob,Pas Michael,Carulli John M.,Makris YiorgosORCID

Funder

Semiconductor Research Corporation Task

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Computer Graphics and Computer-Aided Design,Software

Cited by 9 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Deep Learning-Based Yield Prediction for the Die Bonding Semiconductor Manufacturing Process;Lecture Notes in Electrical Engineering;2024

2. Machine Learning Support for Board-Level Functional Fault Diagnosis;Machine Learning Support for Fault Diagnosis of System-on-Chip;2022-10-22

3. Machine Learning Support for Diagnosis of Analog Circuits;Machine Learning Support for Fault Diagnosis of System-on-Chip;2022-10-22

4. Machine Learning-Based Overkill Reduction through Inter-Test Correlation;2022 IEEE 40th VLSI Test Symposium (VTS);2022-04-25

5. Modeling the Dependency of Analog Circuit Performance Parameters on Manufacturing Process Variations With Applications in Sensitivity Analysis and Yield Prediction;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2022-01
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