Funder
National Natural Science Foundation of China
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Computer Graphics and Computer-Aided Design,Software
Cited by
12 articles.
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1. A Symmetric Bridge-Based Pre-Bond TSV Faults Detection Method;IEEE Transactions on Instrumentation and Measurement;2024
2. A High-Precision Delay Faults Testing Technique Based on the Improved DWR Structure;2023 8th International Conference on Integrated Circuits and Microsystems (ICICM);2023-10-20
3. An Effective Faulty TSV Detection Scheme for TSVs in High Bandwidth Memory;2023 IEEE International Symposium on Circuits and Systems (ISCAS);2023-05-21
4. Novel Error-Tolerant Voltage-Divider-Based Through-Silicon-Via Test Architecture;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2023-01
5. An ILD Void Detection Method for Monolithic 3D ICs Based on Switched Capacitors;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2022