Author:
Chatterjee Ritwik,Zussy Marc,Roman Antonio,Louveau Olivier,Maitrejean Sylvain,Louis Didier,Kernevez Nelly,Sillon Nicolas,Passemard Gerard,Pol Victor,Mathew Varughese,Fayolle Murielle,Garcia Sam,Sparks Terry,Huang Zhihong,Leduc Patrick,Pozder Scott,Jones Bob,Acosta Eddie,Charlet Barbara,Enot Thierry,Heitzmann Michel
Cited by
13 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Recent Advances and Trends in Cu–Cu Hybrid Bonding;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-03
2. Cu-Cu Hybrid Bonding;Chiplet Design and Heterogeneous Integration Packaging;2023
3. Hybrid Bonding;Semiconductor Advanced Packaging;2021
4. 3D Integration;Fan-Out Wafer-Level Packaging;2018
5. Overview and Outlook of Three-Dimensional Integrated Circuit Packaging, Three-Dimensional Si Integration, and Three-Dimensional Integrated Circuit Integration;Journal of Electronic Packaging;2014-10-15