Utilization of ELITE System for Precise Fault Localization of Metal Defect Functional Failure
Author:
Apolinaria Ronald C.
Cited by
3 articles.
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1. Enhanced technique through pattern and power modulation with ELITE system for failure analysis on advance package technology;2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA);2023-07-24
2. Defect localization on operating condition failure of 3D NAND device level using modified Lock-in thermography;2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA);2023-07-24
3. Fault Localization of Functional Failure by using Dynamic EMMI Analysis Technique;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10