Fault Localization of Functional Failure by using Dynamic EMMI Analysis Technique
Author:
Affiliation:
1. Sanechips Technology Co., Ltd,Department of Packaging and Testing,Shenzhen,P. R. China
2. ZTE Corporation,State Key Laboratory of Mobile Network and Mobile Multimedia Technology,Shenzhen,P. R. China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9872527/9872536/09873274.pdf?arnumber=9873274
Reference6 articles.
1. Microelectronics Reliability;beaudoin,2007
2. Utilization of ELITE System for Precise Fault Localization of Metal Defect Functional Failure
3. Critical timing analysis in microprocessors using near-ir laser assisted device alteration (lada)
4. Proceedings of the 9th International Symposium on the Physical and Failure Analysis of Integrated Circuits;cole,2002
5. 18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA);li,2011
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