Effects of inorganic encapsulation on power cycling lifetime of aluminum bond wires-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Effects of inorganic encapsulation on power cycling lifetime of aluminum bond wires

Published:2018-05 Issue: Volume: Page:
ISSN:
Container-title:2018 IEEE 30th International Symposium on Power Semiconductor Devices and ICs (ISPSD)
language:
Short-container-title:

Author:

Jiang Nan,Scheibel Markus G.,Fabian Benjamin,Kalajica Marko,Miric Anton-Zoran,Lutz Josef

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/8387225/8393579/08393648.pdf?arnumber=8393648

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A Fatigue Lifetime Prediction Model for Aluminum Bonding Wires;Metals;2023-10-21

2. State-of-the-art of the bond wire failure mechanism and power cycling lifetime in power electronics;Microelectronics Reliability;2023-08

3. Parametric study on relevant design and material parameters for reliable hard encapsulation of automotive power modules;2022 IEEE 24th Electronics Packaging Technology Conference (EPTC);2022-12-07

4. Lifting-Off of Al Bonding Wires in IGBT Modules Under Power Cycling: Failure Mechanism and Lifetime Model;IEEE Journal of Emerging and Selected Topics in Power Electronics;2020-09

5. A Fully On-Chip Frequency-Stabilization Mechanism for Terahertz Sources Eliminating Frequency Reference and Dividers;IEEE Transactions on Microwave Theory and Techniques;2019-07

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP