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Lifting-Off of Al Bonding Wires in IGBT Modules Under Power Cycling: Failure Mechanism and Lifetime Model

  • Published:2020-09 Issue:3 Volume:8 Page:3162-3173
  • ISSN:2168-6777
  • Container-title:IEEE Journal of Emerging and Selected Topics in Power Electronics
  • language:
  • Short-container-title:IEEE J. Emerg. Sel. Topics Power Electron.

Author:

Huang YongleORCID,Jia Yingjie,Luo Yifei,Xiao Fei,Liu Binli

Funder

National Key Basic Research Program of China

Key Program of National Natural Science Foundation of China

National Natural Science Foundation of China

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Energy Engineering and Power Technology

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1. Intelligent Condition Monitoring of Multiple Thermal Degradation of IGBT Modules Based on Case Temperature Matrix;IEEE Transactions on Power Electronics;2024-10

2. Evolution mechanism of interfacial multi-layer intermetallic compounds and failure behavior in the Al–Au wire bonding;Journal of Materials Research and Technology;2024-09

3. Parameter Correction Method of Vce(on)-Based Junction Temperature Estimation Model Based on Bonding Wire Fatigue;IEEE Journal of Emerging and Selected Topics in Power Electronics;2024-08

4. Research on transformer based online condition monitoring method for IPM;Measurement Science and Technology;2024-07-24

5. Thermal resistance measurement and failure analysis of Multi-discrete SiC MOSFET System Module;2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia);2024-05-17
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