Intelligent Condition Monitoring of Multiple Thermal Degradation of IGBT Modules Based on Case Temperature Matrix-Reference-Cited by-同舟云学术

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Intelligent Condition Monitoring of Multiple Thermal Degradation of IGBT Modules Based on Case Temperature Matrix

Published:2024-10 Issue:10 Volume:39 Page:12490-12501
ISSN:0885-8993
Container-title:IEEE Transactions on Power Electronics
language:
Short-container-title:IEEE Trans. Power Electron.

Author:

Zhan Cao¹^ORCID,Tang Yizheng²^ORCID,Zhu Lingyu²^ORCID,Wang Weicheng²,Gou Yating²^ORCID,Ji Shengchang²^ORCID,Iannuzzo Francesco³^ORCID

Affiliation:

1. Bradley Department of Electrical and Computer Engineering (ECE), Center for Power Electronics Systems (CPES), Virginia Tech, Blacksburg, VA, USA

2. State key Laborary of Electrical Insulation and Power Equipment, Xi'an Jiaotong University, Xi'an, China

3. Department of Energy Technology, Aalborg University, Aalborg, Denmark

Funder

State Key Laboratory of HVDC

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Link

http://xplorestaging.ieee.org/ielx8/63/10659245/10559270.pdf?arnumber=10559270

Reference38 articles.

1. Integrated Sensorless Wireless Charging Using Symmetric High-Order Network for Multistorey Car Parks

2. A Cascaded H-Bridge-Based Multilevel Converter With Low Energy Pulsation for High-Power Grid Applications

3. An Integrated Multiport Circuit Breaker With Current Flow Controlling Capability for Meshed Multiterminal HVDC Grids

4. Thermal Imbalance Among Paralleling Chips in Power Modules and the Impact From Traction Inverter System View

5. In-Situ Calibration Method of Online Junction Temperature Estimation in IGBTs for Electric Vehicle Drives

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