Thermal Imbalance Among Paralleling Chips in Power Modules and the Impact From Traction Inverter System View
Author:
Affiliation:
1. Research and Development Center, Dynex Semiconductor Ltd., Lincoln, U.K.
2. Research and Development Center, Zhuzhou CRRC Times Semiconductor Ltd., Zhuzhou, China
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Control and Systems Engineering
Link
http://xplorestaging.ieee.org/ielx7/41/9955034/09760731.pdf?arnumber=9760731
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4. Thermal transient characterization of semiconductor devices with multiple heat sources—Fundamentals for a new thermal standard
5. Lumped Parameter Modeling for Thermal Characterization of High-Power Modules
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