0.13 μm modular BCD technology enable to embedding high density E2PROM, RF and hall sensor suitable for IoT application-Reference-Cited by-同舟云学术

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0.13 μm modular BCD technology enable to embedding high density E2PROM, RF and hall sensor suitable for IoT application

Published:2016-06 Issue: Volume: Page:
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Container-title:2016 28th International Symposium on Power Semiconductor Devices and ICs (ISPSD)
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Author:

Lee Junghwan,Lee Kyungho,Jung Inchul,Kim Hyunchul,An Heebaeg,Lee Taehoon,Lee Taejong

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/7509008/7520753/07520867.pdf?arnumber=7520867

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