Quantify Device EM Reliability Using Weibullian “k-out-of-N” Redundant System with Load Sharing
Author:
Affiliation:
1. Tesla, Inc.
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9893903/9893894/09893934.pdf?arnumber=9893934
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3. Electromigration effect on Sn-58 % Bi solder joints with various substrate metallizations under current stress
4. A Comprehensive Study of Electromigration in Lead-free Solder Joint
5. Electromigration behavior of SAC(305)/SnBiAg mixed solder alloy assemblies;hadian;Proceedings of SMTA International,2019
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