Characterization of Dual Side Molding SiP Module
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/7998598/7999654/07999813.pdf?arnumber=7999813
Cited by 12 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. New Double Sided Molded Package Platform Development with Open Cavity Mold on One Side and Exposed Die Mold on the Other Side;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
2. Board-Level Drop Impact Reliability Analysis of Dual-Side Molding System-in- Package (SiP) Modules;IEEE Transactions on Electron Devices;2023-01
3. Risk Reduction Strategies for SiP Design and Manufacturing;2022 IEEE 24th Electronics Packaging Technology Conference (EPTC);2022-12-07
4. Simulation of Motor Core Gluing Process with Fine Mesh Nets;Polymers;2022-10-29
5. An Improved Mold Flow Optimization Technology for High-Density Power Modules;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10
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