Assembly and reliability characterization of 3D chip stacking with 30μm pitch lead-free solder micro bump interconnection-Reference-Cited by-同舟云学术

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Assembly and reliability characterization of 3D chip stacking with 30μm pitch lead-free solder micro bump interconnection

Published:2010 Issue: Volume: Page:
ISSN:
Container-title:2010 Proceedings 60th Electronic Components and Technology Conference (ECTC)
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Author:

Zhan Chau-Jie,Chuang Chun-Chih,Juang Jing-Ye,Lu Su-Tsai,Chang Tao-Chih

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/5482824/5490635/05490829.pdf?arnumber=5490829

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