Metal-Alloy Cu Surface Passivation Leads to High Quality Fine-Pitch Bump-Less Cu-Cu Bonding for 3D IC and Heterogeneous Integration Applications-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Metal-Alloy Cu Surface Passivation Leads to High Quality Fine-Pitch Bump-Less Cu-Cu Bonding for 3D IC and Heterogeneous Integration Applications

Published:2018-05 Issue: Volume: Page:
ISSN:
Container-title:2018 IEEE 68th Electronic Components and Technology Conference (ECTC)
language:
Short-container-title:

Author:

Panigrahi Asisa Kumar,Kumar C. Hemanth,Bonam Satish,Brince Paul K.,Ghosh Tamal,Paul Nirupam,Vanjari Siva Rama Krishna,Singh Shiv Govind

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/8415930/8429093/08429750.pdf?arnumber=8429750

Cited by 9 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Low Thermal Budget Fine-pitch Cu/Dielectric Hybrid Bonding with Cu Microstructure Modifications;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

2. In Situ Study on Cu-to-Cu Thermal Compression Bonding;Crystals;2023-06-21

3. Fabrication of On-Silicon Aperture Coupled Patch Antenna Through Micromachining and Cu-Cu Thermocompression Bonding;IEEE Transactions on Semiconductor Manufacturing;2022-11

4. An extensive survey on future direction for the reduction of noise coupling problem in TSV based 3-dimensional IC integration;Materials Today: Proceedings;2021

5. System-in-Package (SiP);Semiconductor Advanced Packaging;2021

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP