Reliability of eWLB (Embedded Wafer Level BGA) for Automotive Radar Applications

Author:

Yap Daniel,Wong Kim Sing,Petit Luc,Antonicelli Roberto,Yoon Seung Wook

Publisher

IEEE

Cited by 10 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

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3. Characterizations for 25G/100G High Speed Fiber Optical Communication Applications with Hermetic eWLB (Embedded Wafer Level Ball Grid Array) Technology;2021 IEEE 71st Electronic Components and Technology Conference (ECTC);2021-06

4. Fan-Out Wafer/Panel-Level Packaging;Semiconductor Advanced Packaging;2021

5. A Novel Panel Level Double Side Embedded Package for Small Size Power Devices;2019 IEEE 69th Electronic Components and Technology Conference (ECTC);2019-05

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