Impact reliability analysis of a rigid-flex PCB system under acceleration loads-Reference-Cited by-同舟云学术

Impact reliability analysis of a rigid-flex PCB system under acceleration loads

Published:2021-12 Issue: Volume:127 Page:114374
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Zhang Bowen,Shan Guangbao,Su Fei

Funder

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference27 articles.

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2. On the design of a parallel link using rigid-flex PCB technology;Knittel,2007

3. Pop-up mars rover with textile-enhanced rigid-flex PCB body;Karras,2017

4. DEVELOPMENT OF THE ALCATEL ETCA PYROSHOCK TEST FACILITY;Filippi,1999

5. Modeling and reliability characterization of area-array electronics subjected to high-g mechanical shock up to 50,000 g;Lall,2012

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