A Modeling and Computational Analysis Method for Multichip DDR Microsystem-Reference-Cited by-同舟云学术

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A Modeling and Computational Analysis Method for Multichip DDR Microsystem

Published:2023-12 Issue:4 Volume:4 Page:336-344
ISSN:2576-3164
Container-title:IEEE Journal on Miniaturization for Air and Space Systems
language:
Short-container-title:IEEE J. Miniat. Air Space Syst.

Author:

Wen Bo¹^ORCID,Xiao Guoyao¹^ORCID,Sun Zongzheng¹^ORCID,Liao Guisheng²^ORCID,Xie Fei³^ORCID,Quan Yinghui¹^ORCID

Affiliation:

1. Department of Remote Sensing Science and Technology, School of Electronic Engineering, Xidian University, Xi’an, China

2. National Key Laboratory of Radar Signal Processing, Xidian University, Xi’an, China

3. School of AOAIR, Xidian University, Xi’an, China

Funder

Science and Technology Innovation Team of Shaanxi Province

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Pharmacology (medical)

Link

http://xplorestaging.ieee.org/ielx7/8253411/10330791/10178048.pdf?arnumber=10178048

Reference28 articles.

1. Low Temperature SoIC Bonding and Stacking Technology for 12-/16-Hi High Bandwidth Memory (HBM)

2. Impact of System-in-Package in side-by-side discrete SoC-DRAM configurations on SI, PI and thermal performance

3. 3-D Compact Marchand Balun Design Based on Through-Silicon via Technology for Monolithic and 3-D Integration

4. Analysis and Experimental Test of Electrical Characteristics on Bonding Wire

5. Power Profiling of Modern Die-Stacked Memory

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