Author:
Chen Dao-Long,Hu Ian,Chen Karen Yu,Shih Meng-Kai,Tarng David,Huang Dinos,On Jy
Cited by
4 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Problems of Microsystems Reliability Design with Redistribution Layers in Wafer Level Packaging;2024 IEEE 25th International Conference of Young Professionals in Electron Devices and Materials (EDM);2024-06-28
2. State-Of-The-Art of Advanced Packaging;Chiplet Design and Heterogeneous Integration Packaging;2023
3. A Quantitative Model to Understand the Effect of Gravity on the Warpage of Fan-Out Panel-Level Packaging;IEEE Transactions on Components, Packaging and Manufacturing Technology;2021-11
4. Fan-Out Wafer/Panel-Level Packaging;Semiconductor Advanced Packaging;2021