Embedded Multi-die Interconnect Bridge (EMIB) -- A High Density, High Bandwidth Packaging Interconnect-Reference-Cited by-同舟云学术

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Embedded Multi-die Interconnect Bridge (EMIB) -- A High Density, High Bandwidth Packaging Interconnect

Published:2016-05 Issue: Volume: Page:
ISSN:
Container-title:2016 IEEE 66th Electronic Components and Technology Conference (ECTC)
language:
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Author:

Mahajan Ravi,Sankman Robert,Patel Neha,Kim Dae-Woo,Aygun Kemal,Qian Zhiguo,Mekonnen Yidnekachew,Salama Islam,Sharan Sujit,Iyengar Deepti,Mallik Debendra

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/7542794/7545393/07545486.pdf?arnumber=7545486

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