Thermo-Compression Bonding and Mass Reflow Assembly Processes of 3D Logic Die Stacks-Reference-Cited by-同舟云学术

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Thermo-Compression Bonding and Mass Reflow Assembly Processes of 3D Logic Die Stacks

Published:2017-05 Issue: Volume: Page:
ISSN:
Container-title:2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
language:
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Author:

Gagnon Pascale,Bergeron Christian,Langlois Richard,Barbeau Stephane,Whitehead Steve,Tyberg Christy,Robertazzi Ray,Sakuma Katsuyuki,Wordeman Matthew,Scheurmann Michael

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/7998598/7999654/07999680.pdf?arnumber=7999680

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Thermo-Compression Bonding of Cu/SnAg Pillar Bumps with Electroless Palladium Immersion Gold (EPIG) Surface Finish;Materials;2023-02-20

2. Fluxless Bonding Via In-Situ Oxide Reduction;2022 IEEE 24th Electronics Packaging Technology Conference (EPTC);2022-12-07

3. Functional Testing of AI Cores through Thinned 3D I/O Buffer Dies in 3D Die-Stacked Modules;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

4. A Study of 3D Packaging Interconnection Performance Affected by Thermal Diffusivity and Pressure Transmission;2019 IEEE 69th Electronic Components and Technology Conference (ECTC);2019-05

5. Micro Copper Pillar Interconnection Using Thermosonic Flip Chip Bonding;Journal of Electronic Packaging;2018-08-06

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