Functional Testing of AI Cores through Thinned 3D I/O Buffer Dies in 3D Die-Stacked Modules-Reference-Cited by-同舟云学术

Functional Testing of AI Cores through Thinned 3D I/O Buffer Dies in 3D Die-Stacked Modules

Published:2022-05 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
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Author:

Farooq Mukta¹,Kumar Arvind¹,Lee Sae-Kyu¹,Bonam Ravi¹,Gomez Juan-Manuel¹,Kelly James¹,Hosokawa Kohji¹,Nomura Akiyo¹,Kohda Yasuteru¹,Dickson Timothy¹,Sakuma Katsuyuki¹,Mori Hiroyuki¹,Rubin Joshua¹,Saraf Iqbal¹,Pai Vinay¹,Nieves Pablo¹,Li Yandong¹,DelaPena Abraham¹,Wassick Thomas¹,Perfecto Eric¹,Carr Christopher¹,Sardesai Viraj¹,Miller Eric¹,Oakley Jennifer¹,Skordas Spyridon¹,Teehan Sean¹,McHerron Dale¹,Burns Jeff¹,Divakaruni Rama¹

Affiliation:

1. IBM Research

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816418.pdf?arnumber=9816418

Reference8 articles.

1. An enhanced thermo-compression bonding process to address warpage in 3D integration of large die on organic substrates

2. Bonding technologies for chip level and wafer level 3D integration

3. IMC bonding for 3D interconnection

4. Thermo-Compression Bonding and Mass Reflow Assembly Processes of 3D Logic Die Stacks

5. Characterization of stacked die using die-to-wafer integration for high yield and throughput

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1. Modeling of the Temperature Profile and Residual Stress During Thermal Compression Bonding in 3D Packages;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05