Author:
Lee Teck Chong,Chang Yung-Shun,Hsu Che-Ming,Hsieh Sheng-Chi,Lee Pao-Nan,Hsieh Yu-Chang,Wang Long-Ching,Zhang Lijuan
Cited by
16 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Warpage Prediction and Optimization for Wafer-Level Glass Interposer Packaging;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-08
2. P‐136: Process Optimization for Fabrication of 3D Through Glass Via (TGV) Inductor;SID Symposium Digest of Technical Papers;2024-06
3. High Q-Factor 3D Tall Copper Pillar Inductor on a Wafer-Level Package for RF System Application;2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT);2023-10-25
4. High Inductance Density Glass Embedded Inductors for 3-D Integration;IEEE Microwave and Wireless Technology Letters;2023-06
5. State-Of-The-Art of Advanced Packaging;Chiplet Design and Heterogeneous Integration Packaging;2023