Glass Based 3D-IPD Integrated RF ASIC in WLCSP

Author:

Lee Teck Chong,Chang Yung-Shun,Hsu Che-Ming,Hsieh Sheng-Chi,Lee Pao-Nan,Hsieh Yu-Chang,Wang Long-Ching,Zhang Lijuan

Publisher

IEEE

Cited by 16 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Warpage Prediction and Optimization for Wafer-Level Glass Interposer Packaging;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-08

2. P‐136: Process Optimization for Fabrication of 3D Through Glass Via (TGV) Inductor;SID Symposium Digest of Technical Papers;2024-06

3. High Q-Factor 3D Tall Copper Pillar Inductor on a Wafer-Level Package for RF System Application;2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT);2023-10-25

4. High Inductance Density Glass Embedded Inductors for 3-D Integration;IEEE Microwave and Wireless Technology Letters;2023-06

5. State-Of-The-Art of Advanced Packaging;Chiplet Design and Heterogeneous Integration Packaging;2023

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