High Q-Factor 3D Tall Copper Pillar Inductor on a Wafer-Level Package for RF System Application-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

High Q-Factor 3D Tall Copper Pillar Inductor on a Wafer-Level Package for RF System Application

Published:2023-10-25 Issue: Volume: Page:
ISSN:
Container-title:2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
language:
Short-container-title:

Author:

Chen Cheng-Ting¹,Lee Pao-Nan¹,Hsu Wei-Chu¹,Hsu Min-Tzu¹,Lin Hung-Yi¹

Affiliation:

1. Advanced Semiconductor Engineering (ASE) Inc.,Kaohsiung 811,Taiwan

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10348606/10348630/10348878.pdf?arnumber=10348878

Reference9 articles.

1. A Novel Compact 2.4/5.2 GHz Dual Wideband Bandpass Filter with Deep Transmission Zero

2. Hybrid Filter Design for 5G using IPD and Acoustic Technologies

3. Optimization design and simulation for a band-pass-filter with IPD technology for RF front-end application

4. Glass Based 3D-IPD Integrated RF ASIC in WLCSP

5. High Q-factor 3D Solenoid Inductor on InFO Package for RF System Integration

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP