Author:
Tang Tzu-Chun,Lin Chia-Chia,Hsu Che-Wei,Lu Chun-Lin,Tsai Chung-Hao,Wu Kai-Chiang,Pu Han-Ping,Liu Chung-Shi,Wang Chuei-Tang,Yu Doug
Cited by
6 articles.
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1. High Q Inductors Fabricated on Glass Substrates for RF Applications;2023 Asia-Pacific Microwave Conference (APMC);2023-12-05
2. High Q-Factor 3D Tall Copper Pillar Inductor on a Wafer-Level Package for RF System Application;2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT);2023-10-25
3. A 3D-Printed Fourth-Order Stacked Filter for Integrated DC-DC Converters;2023 IEEE International Symposium on Circuits and Systems (ISCAS);2023-05-21
4. Design of a Packaged Multi-radius Multi-path Solenoidal Inductor for Redistribution Layers;JOURNAL OF SEMICONDUCTOR TECHNOLOGY AND SCIENCE;2022-12-31
5. Integrated
Fan‐Out
(
InFO
) for Mobile Computing;Embedded and Fan‐Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces;2021-12-03