Author:
Wang Huijuan,Pan Jie,Ren Xiaoli,Liao Anmou,Lu Yuan,Yu Daquan,Shangguan Dongkai
Cited by
2 articles.
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1. High Q-Factor 3D Tall Copper Pillar Inductor on a Wafer-Level Package for RF System Application;2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT);2023-10-25
2. A Compact IPD Based on-Chip Bandpass Filter for 5G Radio Applications;Lecture Notes in Electrical Engineering;2021