8.1 Lakefield and Mobility Compute: A 3D Stacked 10nm and 22FFL Hybrid Processor System in 12×12mm2, 1mm Package-on-Package-Reference-Cited by-同舟云学术

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8.1 Lakefield and Mobility Compute: A 3D Stacked 10nm and 22FFL Hybrid Processor System in 12×12mm2, 1mm Package-on-Package

Published:2020-02 Issue: Volume: Page:
ISSN:
Container-title:2020 IEEE International Solid- State Circuits Conference - (ISSCC)
language:
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Author:

Gomes Wilfred,Khushu Sanjeev,Ingerly Doug B.,Stover Patrick N.,Chowdhury Nasirul I.,O'Mahony Frank,Balankutty Ajay,Dolev Noam,Dixon Martin G.,Jiang Lei,Prekke Surya,Patra Biswajit,Rott Pavel V.,Kumar Rajesh

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9046640/9062887/09062957.pdf?arnumber=9062957

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