Thermal Interaction and Cooling of Electronic Device with Chiplet 2.5D Integration

Abstract

With the development of artificial intelligence (AI) and high-performance computing (HPC), the microelectronic industry is challenged with increased device integration density. Chiplet architecture can break through a variety of limitations on the system-on-chip (SoC) to create a high-computility system. However, chiplet heterogeneous integration suffers from high heat flux and serious thermal interaction problems. The factors affecting thermal interaction are not clear. In this paper, a collective parameter model and a distribution parameter model are developed to clarify the optimization method to mitigate thermal interaction. The trends predicted by the parameter model are consistent with the finite element method (FEM) simulation results. Furthermore, to cool the chiplets, a thermal test vehicle is designed and fabricated, and the cooling performance of the test vehicle with different flow rates, different TIMs (Thermal Interfacial Materials) (DOW5888 vs. liquid metal), and different heat modes is experimentally investigated. Compared with DOW5888, the utilization of liquid metal TIM can mitigate thermal interaction by 56% and 76% at flow rates of 0.2 L/min and 0.8 L/min, respectively. Consequently, at a temperature rise of 60 °C and a flow rate of 0.8 L/min, using liquid metal TIM can achieve heat fluxes of 330 W/cm2 and 520 W/cm2 for two chiplets, respectively.