Hybrid Cu-Cu Bonding with Non-Conductive Paste and Highly (111)-Oriented Nanotwinned Copper-Reference-Cited by-同舟云学术

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Hybrid Cu-Cu Bonding with Non-Conductive Paste and Highly (111)-Oriented Nanotwinned Copper

Published:2020-10-21 Issue: Volume: Page:
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Container-title:2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
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Author:

Kuo Yu-Hao,Chen Chih

Funder

Ministry of Education

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9268496/9268533/09268547.pdf?arnumber=9268547

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. High Temperature Storage of Cu-Cu Joints Fabricated by Highly (111)-oriented Nanotwinned Cu;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

2. Hybrid Cu-to-Cu bonding with nano-twinned Cu and non-conductive paste;Journal of Materials Research and Technology;2022-05

3. Hybrid Bonding of Nanotwinned Copper/organic Dielectrics with Low Thermal Budget;2021 IEEE 71st Electronic Components and Technology Conference (ECTC);2021-06

4. Electromigration and Temperature Cycling Tests of Cu-Cu Joints Fabricated by Instant Copper Direct Bonding;2021 IEEE 71st Electronic Components and Technology Conference (ECTC);2021-06

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