Electromigration and Temperature Cycling Tests of Cu-Cu Joints Fabricated by Instant Copper Direct Bonding-Reference-Cited by-同舟云学术

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Electromigration and Temperature Cycling Tests of Cu-Cu Joints Fabricated by Instant Copper Direct Bonding

Published:2021-06 Issue: Volume: Page:
ISSN:
Container-title:2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
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Author:

Shie Kai-Cheng,Hsu Po-Ning,Li Yu-Jin,Tu K.N.,Lin Benson Tzu-Hung,Chang Chia-Cheng,Chen Chih

Funder

Ministry of Education (MOE) in Taiwan

Ministry of Science and Technology, Taiwan

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9501397/9501403/09501813.pdf?arnumber=9501813

Cited by 8 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Electromigration Failure Mechanisms of Cu-Cu Joints at Low Stressing Temperatures;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

2. Electromigration in three-dimensional integrated circuits;Applied Physics Reviews;2023-05-16

3. Recent Advances and Trends in Cu–Cu Hybrid Bonding;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-03

4. Cu-Cu Hybrid Bonding;Chiplet Design and Heterogeneous Integration Packaging;2023

5. Low-Temperature Cu/SiO2 Hybrid Bonding with Low Contact Resistance Using (111)-Oriented Cu Surfaces;Materials;2022-03-03

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