Analysis of Underfill-Polymer Interfacial Adhesive Strength by Combined Experimental and Modeling Approaches-Reference-Cited by-同舟云学术

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Analysis of Underfill-Polymer Interfacial Adhesive Strength by Combined Experimental and Modeling Approaches

Published:2020-10-21 Issue: Volume: Page:
ISSN:
Container-title:2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
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Author:

Yeh Shu-Shen,Lin P. Y.,Hsu C. K.,Lin Y. S.,Wang J. H.,Lai P. C.,Liao L. L.,Lee T. Y.,Chen C. H.,Yew M. C.,Cheng S. K.,Jeng Shin-Puu

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9268496/9268533/09268535.pdf?arnumber=9268535

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Simulation and Metrological Applications for RDL Patterning Development of Glass Substrate;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

2. Effects of Thermal-Moisture Coupled Field on Delamination Behavior of Electronic Packaging;Journal of Electronic Packaging;2024-01-12

3. Investigation of Underfill Delamination in Flip Chip Packages by Finite Element Analysis;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10

4. Effects of Temperature on the Adhesive Performance of High Tg Underfill in 2.5D Heterogeneous Integrated Packaging;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

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