Simulation and Metrological Applications for RDL Patterning Development of Glass Substrate
Author:
Affiliation:
1. National Tsing Hua University,MMDRAL, PME,Hsinchu,Taiwan, R.O.C
2. Industrial Technology Research Institute,EOSL,Hsinchu,Taiwan, R.O.C
3. Applied Materials,SAP,Tainan,Taiwan R.O.C
Funder
Ministry of Science and Technology
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx8/10564841/10564831/10565108.pdf?arnumber=10565108
Reference12 articles.
1. Panel Warpage of Fan-Out Panel-Level Packaging Using RDL-First Technology
2. Development and Demonstration on Process-Oriented Warpage Simulation Methodology of Fan-Out Panel-Level Package in Multilevel Integration
3. Substrate Trace Modeling for Package Warpage Simulation
4. Warpage Modeling and Characterization of the Viscoelastic Relaxation for Cured Molding Process in Fan-Out Packages
5. Warpage and Simulation Analysis of Panel Level FO-WLCSP Using Equivalent CTE
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